Alyuminiy substratning jarayon oqimi

1. Ochilish

Alyuminiy substrat ishlab chiqarish jarayoni

1. Materialni kesish jarayoni - kesish

2. Ochilishdan maqsad

Katta{0}}oʻlchamdagi kiruvchi materiallarni ishlab chiqarish uchun zarur boʻlgan hajmga kesib oling

3. Materiallarni ochishda ehtiyot choralari

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Burg'ulash

1. Burg'ulash jarayoni

Doweling - Burg'ulash - Tekshirish kengashi

2. Burg'ulashning maqsadi

Keyingi ishlab chiqarish jarayoniga va mijozlarni yig'ishga yordam berish uchun plastinkani joylashtirish va burg'ulash

3. Burg'ulash uchun ehtiyot choralari

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

Ikkinchi matkap: lehim niqobidan keyin jihozdagi asbob teshigi

3. Quruq/ho‘l plyonkali tasvir

1. Quruq / ho'l kino tasvirlash jarayoni

Silliqlash plitasi - plyonka - ekspozitsiya - rivojlanishi

2. Quruq/ho'l plyonkali tasvirning maqsadi

Sxemani yaratish uchun zarur bo'lgan qismlar varaqda ko'rsatilgan

3. Quruq/ho‘l plyonkani tasvirlash uchun ehtiyot choralari

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Kislota/ishqoriy qirqish

1. Kislota/ishqoriy surtish jarayoni

Eching - yechish - quritish - tekshirish taxtasi

2. Kislota/ishqoriy surtishdan maqsad

Quruq / ho'l plyonkani tasvirga olgandan so'ng, kontaktlarning zanglashiga olib keladigan qismini ushlab turing, ortiqcha qismini kontaktlarning zanglashiga olib tashlang va kislota bilan ishlov berish paytida alyuminiy substratning zanglashiga e'tibor bering;

3. Kislota/ishqoriy surtish uchun ehtiyot choralari

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Beshta, ipak ekranli lehim niqobi, belgilar

1. Ipak ekranli lehim niqobi, belgilar jarayoni

Silkscreen - Pishirishdan oldingi-pishirish - Ekspozitsiya - Rivojlanish - Belgilar

2. Ipak ekranli lehim niqobi va belgilarning maqsadi

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Ipak ekranli lehim niqobi va belgilarga e'tibor berish kerak bo'lgan masalalar

① To check whether there is garbage or foreign matter on the board

COB alyuminiy substrat

COB alyuminiy substrat

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-CUT, gong taxtasi

1. V-CUT, gong taxtasi jarayoni

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-CUT, gong taxtasining maqsadi

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. V-CUT va gong taxtasi uchun ehtiyot choralari

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Etti, test, OSP

1. Sinov, OSP jarayoni

Chiziq sinovi - Chidamli kuchlanish sinovi - OSP

2. Sinov, OSP ning maqsadi

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, sinov, OSP ehtiyot choralari

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Sakkizta, FQC, FQA, qadoqlash, jo'natish

1. Jarayon

FQC - FQA - Qadoqlash - Yuk tashish

2. Maqsad

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Diqqat qiling

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3